Xa ukhetha izitshixo ze-smart, kufuneka ugxile kwizinto ezintlanu zezokhuseleko, ukuziqhelanisa, iindlela zebhetri, kunye ne-Anti-ElemicTice Scietion, i-Smart-Elecal Calting kunye neminye imisebenzi inokuthi iphucule umsebenzisi amava .
Intsebenzo yokhuseleko
I-Lock CORT Inqanaba: I-C-verticarico i-COCKing Cores (i-anti-onti-i-anti-kubuchwephesha engaphezulu okanye ilingana nemizuzu engama-270), enamaqhekeza angama-304
Itekhnoloji yokuqhekeza i-anti-racker: I-Anti-Mnyama ye-Electromagnegnetic Umsebenzi wokuthintela ukuhlaselwa kwe-hacker;
Ixhasa imizobo yokhuseleko efana ne-anti-cat ijonga i-pirming, gcina i-alam, njl njl .
Itekhnoloji ye-biometric:
Ukuthathwa kweminwe khetha ukukhetha i-FPC Semiconductors (iqondo lokuvuma<0.001%);
Ukuthathwa kobuso kufuna ukukhanya kwe-3D okanye itekhnoloji ye-binocular ukhusela ukwamkelwa kwe-2D ekubeni iqhekezwe ziifoto .
Indlela yokuvula kunye nokuziqhelanisa
Indlela yokungafumaneki engacacanga:
I-Semiconductor rinterprint (yokuhamba gwenxa)
I-3D yobuso
Iphasiwedi yethutyana / i-NFC
Ukulungelelaniswa komnyango womnyango:
Qinisekisa ubukhulu bomnyango (38-120} mm) kwaye uchwetheze udidi lomzimba (ngokuzenzekelayo / ngokuzenzekelayo);
Iingcango ezinamabhodlo aphezulu kunye nezantsi kufuneka zikhethe imodeli efanelekileyo
Ubomi bebhetri kunye nomsebenzi ongxamisekileyo
Ukukhetha ibhetri:
Iibhetri ze-lithium zingcono kunebhetri eyomileyo (ubomi bebhetri 8-12 iinyanga);
Uhlobo lwe-Ceed-C kufuneka ixhaswe (amandla anokuxhaswa ngokuqhagamshelwa kwibhanki yamandla) .
Isikhumbuzo sebhetri esezantsi: i-app i-app + isikhumbuzo esibini esincinci ukuba siphephe ukuphuma kwamandla ngequbuliso .
